Ribbon Cutting at Hyphen Innovations: October 2025

3250 Kettering Blvd.
Dayton, OH 45439 United States
Hyphen Innovations

Parking is available in the Winsupply lot across the street (Kettering Blvd).

Thursday, October 23, 2025 (4:00 PM - 6:00 PM) (EDT)

4:00PM Welcome Remarks
4:15PM Ribbon Cutting
4:30PM Lab Tours & Networking
6:00PM Conclude

Pricing

Complimentary event. Advanced registration requested. 

Event Details

Join us for a Ribbon Cutting at Hyphen Innovations!

Hyphen Innovations is an engineering technology company founded in 2022 that develops advanced parts to reduce vibration in high-performance machines. The company focuses on critical industries such as aerospace, automotive, and defense, where durability and reliability are essential. Hyphen’s breakthrough technology, called i-DAMP (Inherent Damping Additive Manufacturing Process), is built directly into metal parts using advanced 3D printing. This allows the parts to reduce vibration by up to 95%, helping machines last longer, work more efficiently, and perform better under extreme conditions. By combining cutting-edge design, materials science, and advanced manufacturing, Hyphen is changing how industries handle vibration and material stress.

They are excited to host this ribbon cutting to celebrate their new facility in Moraine, Ohio.


Gallery

Additional Information
Event Contact:
Alainna Haupt
Contact Organization:
Dayton Area Chamber of Commerce
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